N,N,N’,N’-Tetrakis(2-hydroxypropyl)ethylenediamine CAS 102-60-3
N.Preparation of a cyanide free alkaline copper plating solution using N, N ', N' - Tetrakis (2-hydroxypropyl) ethylenediamine In the electroplating industry, alkaline copper plating is mainly used as a base coating for substrates such as iron parts, zinc alloy parts, aluminum alloy parts, brass parts, etc.
Item | Specification |
Boiling point | 175-181 °C0.8 mm Hg(lit.) |
Density | 1.03 g/mL at 20 °C(lit.) |
Melting point | 32°C |
pKa | 14.23±0.20(Predicted) |
resistivity | n20/D 1.4812(lit.) |
purity | 99% |
N. N, N ', N' - Tetrakis (2-hydroxypropyl) ethylenediamine is mainly used as a complexing agent for electroless copper plating. Metal chelating agents are used in circuit board manufacturing for chemical copper plating, soldering flux, and cleaning agents.
Usually packed in 25kg/drum,and also can be do customized package.
N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine CAS 102-60-3
N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine CAS 102-60-3